Supports temperatures up to 350°C or 450°C with optional heated bond heads. Secondary Sources
Handles multi-chip modules, system-in-package (SiP) devices, and thin die assembly (down to 30 μm thick).
The Datacon 2200 Evo platform is celebrated for its flexibility and sub-micron accuracy. Understanding its core capabilities ensures that your production line meets global semiconductor standards. datacon 2200 evo manual pdf kenya
The most trustworthy source for any manual is the equipment manufacturer. In this case, the manufacturer is .
Here is a set of practical tips for Kenyan businesses and technicians using the Datacon 2200 EVO. Supports temperatures up to 350°C or 450°C with
The Datacon 2200 Evo relies on proprietary software for die placement patterns. The manual provides screenshots and command descriptions for:
If you do not have official login credentials, several portions of the manual and technical specifications are hosted on professional sharing platforms: Here is a set of practical tips for
If you have any more details about the product, such as its application (data center, server, storage), or if there are specific aspects you're interested in (performance, features), I can try to offer more targeted advice or information.
: Approximately 1,160 mm x 1,225 mm x 1,800 mm, weighing roughly 1,300 kg. Core Features & Capabilities Datacon 2200 evo advanced - Product details | Besi
platform balances placement precision with volatile production throughput requirements. The table below outlines the non-negotiable performance thresholds of the machine: Technical Parameter Specification Value ±plus or minus m on Advanced edition) Theta Placement Accuracy ±plus or minus 0.10° @ 3 Throughput (Die Attach) Up to 7,000 UPH (Units Per Hour) Throughput (Flip Chip) Up to 3,200 UPH (Without dipping) Programmable Bond Force 0.5 N to 75 N (Up to 500 N on hF models) Maximum Bond Temperature 350°C (Up to 450°C with optional heated head) Wafer Handling Range 2-inch to 12-inch wafers (50 mm to 300 mm) Die Size Capability 0.17 mm to 50 mm Machine Weight Sub-System Infrastructure
Operating advanced semiconductor machinery in Kenya presents unique environmental and logistical challenges. Implementing these manual-guided strategies will prolong machine life:
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